OpTecBB

Photonics Days 2026

7 – 8 Oct 2026 | Berlin , Germany

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Thursday, 8 October 2026 | 14:00 - 18:00

Mikrointegration und Advanced Packaging

Location:Hertz-CabinetTrack:in presence
  • Microintegration
  • AI
  • Advanced Packaging

Microintegration and Advanced Packaging have been on everyone’s lips, particularly since the growing demand for bandwidth and power consumption in the latest generations of chips. Photonics can offer solutions to the challenges facing the next generations of data centres. In this session, we will provide an insight into the latest developments in this field.

Agenda:

14:00 - 14:35 "Semicon goes Photonics - latest Trends and forecast", Dr. Adrian Mahlkow (OpTecBB)

14:35 - 15:00 "Hybrid Photonics Integration (tbc)", Dr. Dominic Schulze (Fraunhofer HHI)

15:00 - 15:25 "Mikrointegration in Taiwan (tbc)", Dr. Tse-Hsiang (Eric) Chang (ITRI Europe)

15:25 - 15:50 tbc

15:50 - 16:25 Coffee break

16:25 - 16:50 "Glass panel integration (tbc)", Philipp Wachholz (Eyonex Glass)

16:50 - 17:15 "Stepper-Based Desktop Solutions for Active & Passive Photonic Alignment and Assembly", Thorben Windeler & Achim Weber (GMT Europe GmbH)

17:15 - 17:40 tbc

17:40 - 18:00 Wrap-up

3 speakers

  • CEO

    OpTecBB e.V.

  • Head of Business Development & Strategy

    Fraunhofer Heinrich Hertz Institut

  • Product Manager

    GMT Europe GmbH

Location image

Session location Hertz-Cabinet