Thursday, 8 October 2026 | 14:00 - 18:00
Mikrointegration und Advanced Packaging
- Microintegration
- AI
- Advanced Packaging
Microintegration and Advanced Packaging have been on everyone’s lips, particularly since the growing demand for bandwidth and power consumption in the latest generations of chips. Photonics can offer solutions to the challenges facing the next generations of data centres. In this session, we will provide an insight into the latest developments in this field.
Agenda:
14:00 - 14:35 "Semicon goes Photonics - latest Trends and forecast", Dr. Adrian Mahlkow (OpTecBB)
14:35 - 15:00 "Hybrid Photonics Integration (tbc)", Dr. Dominic Schulze (Fraunhofer HHI)
15:00 - 15:25 "Mikrointegration in Taiwan (tbc)", Dr. Tse-Hsiang (Eric) Chang (ITRI Europe)
15:25 - 15:50 tbc
15:50 - 16:25 Coffee break
16:25 - 16:50 "Glass panel integration (tbc)", Philipp Wachholz (Eyonex Glass)
16:50 - 17:15 "Stepper-Based Desktop Solutions for Active & Passive Photonic Alignment and Assembly", Thorben Windeler & Achim Weber (GMT Europe GmbH)
17:15 - 17:40 tbc
17:40 - 18:00 Wrap-up
3 speakers
CEO
OpTecBB e.V.
Head of Business Development & Strategy
Fraunhofer Heinrich Hertz Institut
Product Manager
GMT Europe GmbH
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